619D No-Clean Leaded Solder Paste
Designed for syringe dispensing probable soft residues spread from joints. Bellcore compliant. Excellent dot-to-dot consistency - Non corrosive - Pin Testable post solder residue - Excellent wetting on OSP.gh gh tack force and good wetting. It meets J-STD-004/005 requirements and complies with Bellcore specifications. It is suitable for reflow in air or nitrogen atmosphere. New advanced formulations meet additional performance criteria such as high print speed, maximum stencil open time, pin testable residues and are virtually free from solder
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