670I No-Clean Leaded Solder Paste
Designed for surface mount and other electronic assembly applications. High tack formula for use in high speed component placement systems. After reflow, a non-corrosive, non-conductive, highly insulated, transparent residue remains.rmulated for finepitch printability, increased stencil life, high tack force and good wetting. It meets J-STD-004/005 requirements and complies with Bellcore specifications. It is suitable for reflow in air or nitrogen atmosphere. New advanced formulations meet additional performance criteria such as high print speed, maximum stencil open time, pin testable residues and are virtually free from solder-beading and solder balls.
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Paste Packaging Options
Jar 3-4 oz. 250-500 grams
Semco & Pyle Cartridge., 6 oz., cartridge 700 grams & 12 oz., 1400 gms.
Syringe 10cc., Syringe 35gms. & 30cc., syringe 100 grams
DEK ProFlow 8 oz., Cassette 800 gms.