Q-Pearl BGA Solder Spheres
Qualitek manufactures Q-Pearls using a new technology that assures exact alloy composition, consistent and accurate diameters and highly spherical shapes of the spheres.

All spheres are made from pure metals combines to provide required alloy composition according to J-STD-006 specification or customer specific. After forming the spheres are classified for size by a precise and non-abrasive sorting process. The diameters of the spheres are monitored and controlled within 0.001" +/- 0.0005" tolerance. Sphere size distribution is measured precisely by a sophisticated image analysis system connected to scanning Electron Microscope (SEM). To determine sphericity, sphere diameter is measured in 16 directions ina fraction of a second.

Sphere Size & Composition
Choosing the correct alloy and sphere size is based on the type of BGA package and the processing temperature of your assembly. Solder Spheres in Ball Grid Array packages are used to provide the electrical and mechanical connection between the component and the board assembly.
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Qualitek Paste Fluxes
Qualitek paste flux is a combination of tackifier and fluxing agent specially formulated for touch-up soldering. BGA packages and flip chip applications. Paste flux may be applied by screen or stencil printing, pin-transfer and syringe dispensing. Four types of paste flux are available: Rosin Mildly Activated PF 200, Activated Rosin PF 400, No-Clean PF600, and Water-Soluble PF 700.
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