818 No-Clean Leaded Solder Paste


		818 No-Clean Leaded Solder Paste Robust paste, provides good stencil life and excellent wettability. high tack force and good wetting. It meets J-STD-004/005 requirements and complies with Bellcore specifications. It is suitable for reflow in air or nitrogen atmosphere. New advanced formulations meet additional performance criteria such as high print speed, maximum stencil open time, pin testable residues and are virtually free from solder Request Sample \| Request Quote \| Tech. Data \| Msds \| View Comparison Chart
	Paste Packaging Options Jar 3-4 oz. 250-500 grams Semco & Pyle Cartridge., 6 oz., cartridge 700 grams & 12 oz., 1400 gms. Syringe 10cc., Syringe 35gms. & 30cc., syringe 100 grams DEK ProFlow 8 oz., Cassette 800 gms.