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Delta No-Clean Solder Paste Delta no-clean solder paste is formulated for finepitch printability, increased stencil life, high tack force and good wetting. It meets J-STD-004/005 requirements and complies with Bellcore specifications. It is suitable for reflow in air or nitrogen atmosphere. New advanced formulations meet additional performance criteria such as high print speed, maximum stencil open time, pin testable residues and are virtually free from solder-beading and solder balls. |
Leaded No-Clean Solder Paste Comparison Chart |
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| Formulations | ||||||
| Flux Classification |
RELO |
RELO |
RELO |
RELO |
RELO |
RELO |
| Post Reflow Residues |
4.5-5.0 |
4.0-4.5 |
4.0-4.5 |
5.0-5.5 |
6.0-6.5 |
5.0-5.5 |
| Standard Metal Load | 90% |
89% |
90.2% |
90% |
88% |
88% |
| Application | Stencil Printing |
Stencil Printing |
Stencil Printing |
Stencil Printing |
Syringe Dispensing |
Syringe Dispensing |
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| Paste Pkg. Options |
Jar 3-4 oz. 250-500 grams Semco & Pyle Cartridge., 6 oz., cartridge 700 grams & 12 oz., 1400 gms. Syringe 10cc., Syringe 35gms. & 30cc., syringe 100 grams DEK ProFlow 8 oz., Cassette 800 gms. |
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