Qualiteks Delta Lead Free No-Clean Solder Paste
Formulated for finepitch printability, increased stencil life, high tack force and good wetting. Meet J-STD-004/005 requirements and complies with Bellcore specifications. Formulations suitable for reflow in air or nitrogen atmosphere. New advanced formulations meet additional performance criteria such as high print speed, maximum stencil open time, pin testable residues and are virtually free from solder-beading and solder balls.

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Qualiteks Delta Lead Free Water-Soluble Solder Paste
Formulated to accommodate a broad range of SMT applications where water/aqueous post reflow cleaning is required. Qualiteks unique formulations produce reliable solder joints that are shiny and bright.

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Lead Free Solder Paste

Fluxing activity levels promote thermal stability and prevent thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, Qualitek’s lead free solder pastes provide excellent cost savings. Formulations exhibit superior joint strength, excellent wettability, and extraordinary print definition and tack life. Qaulitek’s patent pending LF Green Solder Pastes are formulated to help avoid cross contamination between leaded and lead free solder pastes, most useful in a mixed production environment.

Paste Packaging Options
Jar 3-4 oz. 250-500 grams
Semco & Pyle Cartridge., 6 oz., cartridge 700 grams & 12 oz., 1400 gms.
Syringe 10cc., Syringe 35gms. & 30cc., syringe 100 grams
DEK ProFlow 8 oz., Cassette 800 gms.