Home

QUALITEK BGA 2025 REWORK STATION
• Non-contact infrared temperature sensor achieves closed loop control during rework.
• Recommended for the lead free process and for BGA re-balling
• Highly automated one touch key may be programmed to operate the de-soldering process, and pick-n-place of components.
• Intergraded structural design for optical aligning, placing mechanism and heating system.
• Hot air nozzle used in preheating plate for sectional heating. Minimizes upright temperature differences between BGA packing surface and soldering joint, and shortens BGA soldering time.
| View All BGA Stations |

 

2025 Specifications: Rework Station
General Power
3500W(max)
Power of Bottom Heater
450W*4=1800W(infrared heating tube)
Power of Top Heater
180W*4=720W(infrared heating tube)
Power Of Bottom Hot Air Preheater
700W
Size of Bottom Heater
450mm*648mm
Adjusting Range of Top Heater

X direction: 20~100mm Y direction: 20~60mm

Top Cooling Fan
12V/300mA 15CFM
Laser Alignment Tube
3V/30mA
Movable Motor
24VDC/100mA
Max PCB Size
600mm*600mm
LCD Display Window
100*75mm 16*2 characters
Communication
RS-232C (connect with PC)
Min IC Size
2*2mm
Max IC Size
60*60mm
Camera

12V/300Ma; 22*10 times magnifying; Horizontal resolution: 480 lines; PAL format

Camera Output Signal
Video signal
Placement Precision
± 0.025mm