Recommended Lead Free Solder Alloy
TAL (Take Action Limits)

Take Action Limits, also known as ‘dump pot specifications,’ are very important to any electronics manufacturing company using flow soldering techniques either in selective soldering or wave soldering. Impurities in lead free solder can cause the characteristics of the alloy to change and result in assembly defects.

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RECOMMENDED LEAD FREE SOLDER ALLOY
TAL (Take Action Limits)
 
 
Element
TAL
Comments
 
SAC305
SN100E
 
Tin (Sn)
BAL
BAL
 
 
Lead (Pb)
0.10
0.10
RoHS Directive 2002/95/EC Maximum  
 
Copper (Cu)
0.30-1.00
0.30-1.00
Above 1.00% may cause bridging and sluggish
solder flow.
 
 
Bismuth (Bi)
0.20
0.20
If levels exceed 0.2% contamination source should
be investigated.
 
 
Zinc (Zn)
0.003
0.003
May cause higher levels of bridging, icicling and
surface oxidation.
 
 
Iron (Fe)
0.02
0.02
Indicator of pot erosion and may cause joint gritty
formation and the formation of FeSn2
 
 
Silver (Ag)
2.8-3.5
0.20
Solderability can be affected.
 
 
Antimony (Sb)
0.20
0.20
Lead free alloys can tolerate up to 1.0%  
 
Nickel (Ni)
0.05
0.05
Slow wetting speed and reduce hole fill.
 
 
Cadmium (Cd)
0.003
0.003
RoHS Directive 2002/95/EC Maximum  
 
Aluminum (Al)
0.002
0.002
May cause higher levels of bridging, icicling and
surface oxidation
 
 
Gold (Au)
0.10
0.10
At levels above 0.1% joint strength may be
compromised.
 
 
Arsenic (As)
0.03
0.03
Levels greater than 0.03% can cause de-wetting.
 
 
Cobalt (Co)
N/A
<0.01
Solderability can be affected and long term joint reliability at risk.  
 
Germanium (Ge)
N/A
<0.005*
* Solder drossing, sluggish * Applies to a popular Sn/Cu/Ni/Ge alloy only.  
 
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