WHAT IS SO SPECIAL?
This unique patented alloy has been developed as a lead free alternative for those now using costly SAC alloys and for those switching from lead containing Sn63/Pb37 alloys to the lead free process. SN100e is manufactured from tin, copper, and cobalt to create solder so pure it far exceeds the most common specification requirements. The lead-free solder alloy is RoHS compliant and reduces copper dissolution. This alloy provides brighter, shinier, less grainy solder joints when compared to other lead free alloys such as SAC305 and is much less expensive.
SN100e is primarily used in printed circuit board assembly operations common to the electronics market. It is an available choice lead free alloy for the following Qualitek products:
• Solder Paste
• Wire Solder
• Bar Solder
• Solder Spheres
• Solder Powder
MIXING LEAD FREE ALOYS
SN100e is compatible with all SAC and Sn/Cu alloys. SN100e performs with ENIG, immersion tin, immersion silver, OSP, and hot air leveled board finishes. SN100e provides the ability to standardize on one lead-free alloy for all soldering processes (wave, SMT, selective, and re-work).
SN100e CONTAINS COBALT
Other known alloys contain nickel. The ratio of nickel commonly used in comparison to cobalt requires more frequent monitoring due to the increased depletion of the nickel in comparison to cobalt during process resulting in an increased cost for those using the nickel containing alternative alloys.
Certificates of Analysis and Conformance are automatically provided with each shipment. Qualiteks SN100e solders meet or exceed the rigid requirements of Specification J-STD-006.
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