Lead Free Solder Paste

Fluxing activity levels promote thermal stability and prevent thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, Qualitek’s lead free solder pastes provide excellent cost savings. Formulations exhibit superior joint strength, excellent wettability, and extraordinary print definition and tack life. No-clean post solder residues are non-conductive, non-corrosive and highly insulated.